- All sections
- H - Electricity
- H01R - Electrically-conductive connections; structural associations of a plurality of mutually-insulated electrical connecting elements; coupling devices; current collectors
- H01R 12/71 - Coupling devices for rigid printing circuits or like structures
Patent holdings for IPC class H01R 12/71
Total number of patents in this class: 3896
10-year publication summary
|
311
|
299
|
340
|
422
|
451
|
411
|
425
|
334
|
302
|
97
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Molex, LLC | 1792 |
178 |
| Foxconn Interconnect Technology Limited | 1034 |
172 |
| Japan Aviation Electronics Industry, Limited | 1585 |
157 |
| TE Connectivity Solutions GmbH | 2580 |
115 |
| Sumitomo Wiring Systems, Ltd. | 9367 |
96 |
| Lotes Co., Ltd. | 346 |
85 |
| Samsung Electronics Co., Ltd. | 131630 |
72 |
| Intel Corporation | 45621 |
72 |
| Amphenol Corporation | 748 |
71 |
| Molex Incorporated | 609 |
62 |
| Hirose Electric Co., Ltd. | 325 |
61 |
| Murata Manufacturing Co., Ltd. | 22355 |
55 |
| Panasonic Intellectual Property Management Co., Ltd. | 27812 |
54 |
| Foxconn (Kunshan) Computer Connector Co., Ltd. | 286 |
53 |
| Dongguan Luxshare Technologies Co., Ltd. | 191 |
53 |
| Sumitomo Electric Industries, Ltd. | 14131 |
52 |
| AutoNetworks Technologies, Ltd. | 5809 |
51 |
| Huawei Technologies Co., Ltd. | 100781 |
48 |
| Kyocera Corporation | 12735 |
48 |
| Iriso Electronics Co., Ltd. | 184 |
46 |
| Other owners | 2295 |